Huawei and Chinese scientists build a 2D parallel computing chip that rewrites Moore's Law
Researchers from Huawei and Chinese universities have developed a new chip architecture that uses two-dimensional materials for parallel computing, SCMP reported. The design could surpass the energy and speed limits of conventional silicon chips. The results were published in Nature; commercial application could take years.
Researchers at Chinese tech group Huawei and at Peking and Tsinghua universities have jointly developed a new parallel computing chip that uses two-dimensional semiconductor materials, according to SCMP reporting. The design aims to overcome the energy and thermal limits that conventional silicon chips face when more transistors are packed together. The findings were published in the scientific journal Nature.
The work involves arranging logic gates horizontally side by side using atom-thin materials. When combined with three-dimensional stacking, the system is said to have the potential to lift compute efficiency for artificial-intelligence workloads. The authors stressed that the prototype has been built on a small scale and that additional years of research and development are needed to reach commercial production maturity.
With US controls on advanced chip exports still in place, China's semiconductor ecosystem continues to develop domestic alternatives. Analysts spoken to by SCMP said scalability of the approach remains uncertain. The information in this article relies on the source's reporting and is not a substitute for professional advice on investment decisions related to technology companies.
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