Nvidia and SK Hynix to unveil cooperation plan as Huang warns of prolonged chip shortage
Nvidia CEO Jensen Huang and SK Group Chairman Chey Tae-won will brief the media in Seoul on a cooperation plan covering HBM memory supply and fab expansion, an SK Hynix spokesperson said, confirming a Newsis report. Huang separately described the AI-chip shortage as "prolonged."
An SK Hynix spokesperson said Huang and Chey will use their Monday-morning Seoul briefing to outline a multi-year HBM supply deal covering 2027-2030 and additional fabrication capacity planned in Cheongju. According to a Newsis report, the plan would raise the HBM line allocated to Nvidia by roughly 40%, in exchange for a firm volume commitment from Nvidia across the GB200 and Vera Rubin generations.
In separate comments during a Taiwan stop, Huang described AI-chip supply tightness as "prolonged," saying waiting lists for the H200, B200 and next-generation Vera Rubin platforms now stretch into 2027. He added that TSMC's Arizona fab is unlikely to reach full output before 2028 and that the CoWoS advanced-packaging bottleneck cannot be resolved in the short term.
Micron and Samsung Electronics are also expanding HBM capacity; Samsung's new P5 line in Pyeongtaek is expected to ship HBM4 samples in the final quarter of 2026. Strategists noted that Korean press is reading the Nvidia–SK Hynix tie-up as a share shift within the AI-chip supply chain that could disadvantage rivals; the commentary was framed as analysis, "not investment advice."
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