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Asia

Huawei's new chip scaling law aims to sidestep the ASML chokepoint

Huawei has unveiled a new scaling law and chip architecture designed to work around one of China's most crippling chipmaking bottlenecks. The firm aims for products equivalent to a 1.4-nanometre node by 2031, but analysts warn manufacturing hurdles remain.

A silicon wafer in a semiconductor fabrication clean room
Photo: panumas nikhomkhai / Pexels
South China Morning Post1 h agoASML

Huawei Technologies has introduced a new scaling law and chip architecture designed to work around one of China's most crippling chipmaking bottlenecks. According to the SCMP, the US-sanctioned company says the approach, unveiled on Monday, aims to deliver products equivalent to an advanced 1.4-nanometre processing node by 2031.

If borne out, that would mark a significant milestone for Huawei, which has been cut off from access to advanced lithography equipment. The cutting-edge machines made by the Netherlands' ASML are cited as among the main obstacles to China producing its most advanced chips.

Even so, analysts stress that the country's path to semiconductor independence remains constrained by manufacturing challenges. Turning a design advance into mass production depends on clearing hurdles such as yield, cost and scalability. This article is not investment advice.

TechTradeGeopoliticsASMLAsiaSouth China Morning Post
This article is an AI-curated summary of the original story published by South China Morning Post. The illustration is a stock photo by panumas nikhomkhai from Pexels and is not from the original story.

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